型號: | GL3224 |
廠 商: | 中國 |
品牌/商標(biāo): | GENESYS/創(chuàng)惟科技 |
產(chǎn)品類別: | GENESYS/創(chuàng)惟科技- |
聯(lián)系人: | 顏先生/William |
電話: | 0755-82170220,21001680 |
GL3224 電子元器件 GENESYS/創(chuàng)惟科技 封裝QFN-48 USB 3.0雙/單LUN 記憶卡讀卡器控制器
FEATURES
USB specification compliance
- Comply with Universal Serial Bus 3.0 Specification rev. 1.0 (USB 3.0)
- Comply with Universal Serial Bus Specification rev. 2.0 (USB 2.0)
- Comply with USB Mass Storage Class Specification rev. 1.0
- Support USB Mass Storage Class Bulk-Only Transport (BOT)
- Support 1 device address and up to 3 endpoints: Control (0) / Bulk Data Read In (1) / Bulk Data Write Out (2)
- Support 5 Gbps SuperSpeed, 480 Mbps high-speed, and 12 Mbps full-speed transfer rates
Integrated USB building blocks
- USB2.0 transceiver macrocell (UTM), Serial Interface Engine (SIE), embedded Power-On Reset (POR)
Embedded high speed 8051 micro-controller
High efficient DMA hardware engine improves transfer rate between USB and flash card interfaces
Support Ssecure DigitalTM v1.0/ v1.1/ v2.0/ SDHC/ SDXC (Capacity up to 2TB)
Support Secure DigitalTM v3.01 UHS-I (Ultra High Speed): SDR12/ SDR25/ SDR50/ DDR50/ SDR104
Support Secure DigitalTM v5.0
Support MultiMediaCardTM (MMC)
- MMC specification v3.x/ v4.0/ v4.1/ v4.2
- x1/ x4/ x8 bit data bus
Support Embedded MultiMediaCard TM (e•MMC)
- e•MMC specification v4.3/ v4.4/ v4.5/ v5.0
- High Speed SDR/ High Speed DDR/ HS200
Support Memory StickTM/ Memory Stick PROTM/ Memory Stick PRO DuoTM/ Memory Stick PRO Duo Mark2TM/ Memory Stick MicroTM (M2)/ Memory Stick PRO-HGTM/ Memory Stick PRO-HG DuoTM/ Memory Stick PRO-HG Duo HXTM
- Compliant with Memory Stick Series Specification: MS v1.43, MS PRO v1.05, MS Micro v1.04 (MS HG Micro v1.00), MS PRO-HG Duo 1.03, MS XC Duo v1.00, MS XC-HG Duo v1.00, MS XC Micro v1.00 and MS XC-HG Micro v1.00
- Support Read/Write quad data access (512Bytex4) for MS PRO-HG to enhance the transmission rate
Support Serial Peripheral Interface (SPI) for firmware upgrade to SPI Flash Memory via USB interface
Support operation by either MASK ROM or external FW in SPI Flash Memory
On-Chip power MOSFETs for all flash media cards power source
On-chip 5V to 3.3V and 3.3V to 1.2V regulator
On board 25 MHz Crystal driver circuit
Support USB2.0 LPM (Link Power Management)
Support USB3.0 LTM (Latency Tolerance Messaging)
Support USB3.0 U1/U2/U3 low power link state
Pass the USB-IF Test Procedure for SuperSpeed product (TID: 340890039)
Pass WHCK (Windows Hardware Certification Kit) test for Windows 8.1 (Submission ID: 1620543)
Pass WHCK (Windows Hardware Certification Kit) test for Windows 8 (Submission ID: 1620537)
Pass WHQL (Windows Hardware Quality Lab) test for Windows 7 (Submission ID: 1620861)
Support two SD3.0 interfaces with UHS-I: SDR12/ SDR25/ SDR50/ DDR50/ SDR104 bus mode
Support programmable disable MMC interface
Support programmable various LUN (Logic Unit Number): 2 LUNs and 1 LUN
Support programmable SSC (Spread Spectrum Clocking), clock rate in SD, MS memory card interface for better EMI test effect.
Support programmable LED behavior, Read Only option for specific application
Support power-saving mode to disconnect USB bus by card remove for better power management
Support selective-suspend for entering suspend mode when data transfer pending after several seconds.
Support Over-Current protection mechanism
Available in QFN48 pin package (7x7mm) for 2 LUNs: SD3.0/MSPRO-HG and microSD3.0/M2; 1 LUN for e•MMC v4.5/ 8bit data bus/ HS200 mode; with SPI I/F for FW upgrade.
Available in QFN32 pin package (5x5mm), 1 LUN: SD3.0; with SPI I/F for FW upgrade.